Technical Information
HiPak Single IGBT Module
VCE = 4500 V ,IC = 650 A
* Ultra low-loss, rugged SPT+ chip-set
* Smooth switching SPT+ chip-set for good EMC
* Industry standard package
* High power density
* AlSiC base-plate for high power cycling capability
* AlN substrate for low thermal resistance
* Improved high reliability package
* Recognized under UL1557, File E196689
WEEE Category
Product Not in WEEE Scope
