PVP-C-75

Key Features

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  1.High Precision SuctionThe PVP-C-75 features a porous fluorine resin suction surface, ensuring highly accurate workpiece suction even for ultra-thin materials.
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  2.Material CompatibilitySuitable for handling soft materials such as film and glass, making it ideal for semiconductor manufacturing processes.
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  3.Reduced DeformationThe precise flatness processing of the suction surface reduces deformation of the workpiece during suction, ensuring minimal damage.
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  4.Customizable OptionsAvailable in various shapes (round, donut, square), including a black type without scratches or glare, customizable upon request.
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