Note
Application notes:Suitable for lead-free, reflow-soldering profiles per DIN EN 61760-1 and IEC 60068-2-58 up to max. 260°C peak temperature. Due to application-specific variables (component configuration and orientation, type of soldering machine, solder paste), trial runs are recommended to ensure product and process compatibility under actual manufacturing conditions.
Recommendation
Recommendation for stencil:150 渭m material thickness; Pattern layout identical to solder pad layout
Clamping units
2
Total number of potentials
2
Number of connection types
