Detailed engineering parameters based on manufacturer documentation
Specifications may be subject to change without notice
Parameter
Value
Parameter
Value
Note
Application notes:Suitable for lead-free, reflow-soldering profiles per DIN EN 61760-1 and IEC 60068-2-58 up to max. 260°C peak temperature. Due to application-specific variables (component configuration and orientation, type of soldering machine, solder paste), trial runs are recommended to ensure product and process compatibility under actual manufacturing conditions.
Recommendation
Recommendation for stencil:150 渭m material thickness; Pattern layout identical to solder pad layout
Clamping units
1
Total number of potentials
1
Number of connection types
1
Number of levels
1
Pin spacing
3 mm / 0.118 inches
Width
2.9 mm / 0.114 inches
Height
2.7 mm / 0.106 inches
Depth
7.9 mm / 0.311 inches
Reel diameter of tape-and-reel packaging
380mm
Tape width
16mm
PCB contact
SMD
Solder pin arrangement
over the entire terminal strip (in-line)
Number of solder pins per potential
2
Note (material data)
Information on material specifications can be found here
